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MPI / Fusion
MPI/Fusion is the
fastest way to prepare CAD solid models for in-depth filling, packing,
optimization, cooling, and warpage simulations while reducing the
time needed for model preparation.
You can also take advantage of MPI/Fusion benefits when you use
MPI simulation modules for thermoset molding processes.
Using MPI/Fusion, you can refine the part and mold design, material,
and processing conditions to achieve the optimum balance between
quality, cost, and time. There is no need to create a midplane model!
Capabilities
| Analyze
Solid Geometry |
MPI/Fusion allows users
to analyze a CAD solid model directly rather than having to
go through the process of generating an analysis specific
midplane mesh.
MPI/Fusion supports 3D CAD files in STL, Patran Neutral, I-deas
Universal, Nastran BDF, and Ansys formats, among others.
Users can also analyze Moldflow Part Adivser and Mold Adviser
files directly.
MPI/Fusion offers all the same mesh editing tools that are
available for working with midplane models.
Users can display and edit the thickness of the mesh to improve
the design of the part:
- Easily add flow leaders and/or flow restrictors.
- Add ribs and bosses within the MPI environment.
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| Solution
Breadth |
Thermoplastics users can
run a complete asymmetric filling, packing, optimization,
cooling, and warpage analysis on a 3D CAD solid model.
Thermoset users can simulate reactive injection molding processes
as well as the microchip encapsulation and Underfill encapsulation
molding processes using a 3D CAD solid model also. |
Features
| Filling
and Packing Analyses |
MPI/Fusion integrates with
MPI/Flow to simulate the filling and packing stages of the
thermoplastic injection molding process.
The combination of MPI/Fusion and MPI/Flow also allows the
use of the 3D CAD solid model to simulate:
- Automatic Runner Balancing
- Automatic Gate Location
- Molding Window Optimization
- Design of Experiments (DOE) |
| Fiber
Analysis |
Fibers play an important
part in the design and manufacture of plastic parts. MPI/Fusion
integrates with MPI/Fiber to accurately predict the orientation
of fibers and the thermo-mechanical property distribution
in the molded part. |
| Warpage
Analysis |
MPI/Fusion links to MPI/Warp
to accurately predict the shrinkage and warpage of the molded
part. Users no longer have to create a midplane model to determine
if their design will manufacture without deformation. |
| Optimization
Analysis |
MPI/Optim can be used in
conjunction with MPI/Fusion to determine the optimum filling
and packing profiles to be used on the molding machine which
produce parts that meet user specified criteria. |
| Reactive
Molding Analysis |
MPI/Fusion can be used with
MPI/Reactive Molding to simulate thermoset molding processes
on the 3D CAD solid model:
- Reaction injection molding (RIM)
- Structural reaction injection molding (SRIM)
- Resin transfer molding (RTM) |
| Microchip
Encapsulation Analysis |
The benefits of using the
MPI/Fusion solids-based analysis extend to the MPI/Microchip
Encapsulation simulation as well. Any company involved in
the design and manufacture of microelectronic devices can
benefit. |
| Underfill
Encapsulation Analysis |
MPI/Fusion also links with
the MPI/Underfill Encapsulation module, which is used to analyze
the flow of the encapsulant material in the cavity, between
the chip and the substrate during the Underfill encapsulation
process. |
| Extends
the Capabilities of Moldflow Plastics Advisers Software |
Part and mold designers
using Moldflow Plastics Advisers (MPA) software can quickly
and easily check their CAD solid models for manufacturability.
When the MPA results indicate that a more in-depth analysis
is required to rule out unexpected problems, designers can
simply export the model for analysis with MPI/Fusion.
Analysts using MPI/Fusion can then undertake a more detailed
analysis to optimize the design as required. This allows the
analysts to extend MPA capabilities to include full asymmetric
filling, packing, optimization, fiber, cooling, and warpage
analyses.
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