In thick parts, molten plastic can flow in all directions. Using a proven solution technique based on a solid tetrahedral, finite-element volume mesh, MPI/3D solutions allow you to perform true, three-dimensional simulations on parts that tend to be very thick and solid in nature, as well as those that have extreme thickness changes.

Capabilities

The MPI/Synergy pre- and post- processor can be used to create a 3D solid tetrahedral mesh model for use in MPI/3D analyses

Tetrahedral mesh solid models in the following file formats are also supported:
- SDRC Universal
- Nastran Bulk Data
- PATRAN Neutral
- ANSYS Prep 7

Surface triangle mesh models in one of the formats listed above may be used, as the surface model can be remeshed with 3D tetrahedral elements

Geometry import formats will also be meshed with 3D tetrahedral elements. Supported formats include:
- IGES
- Parasolid (add-on option)
- Pro/ENGINEER (add-on option)
- STEP (add-on option)

Tetrahedral elements can be remeshed automatically and anisotropically for optimal analysis performance

Mesh optimization scheme to create a homogenous mesh (uniform aspect ratios and mesh density) in the thickness direction of relatively thin sections of the part geometry

Local mesh refinement capability to increase/decrease numbers of layers of elements in specific areas.

Why use MPI/3D

For thick, solid geometry, true 3D simulation is required to establish exactly where weld lines will form and air traps will occur

With MPI/3D, all velocities, pressures, temperatures, flowfront positions and heat transfer effects are computed in three dimensions

Ease-of-Use

MPI/3D simulation is based on the analysis of a 3D tetrahedral volume mesh created directly from a solid CAD model, resulting in significant model preparation time savings

The MPI/Synergy pre- and post-processor provides one familiar and consistent environment for performing all MPI/3D tasks

Thermoset material users can simulate reactive molding processes using MPI/3D

Filling and Packing Analyses

MPI/3D integrates with MPI/Flow to simulate the filling and packing stages of the injection molding process for thermoplastic materials

Filling and packing analyses can be run sequentially, or a stand-alone packing analysis can be run independent of a filling analysis

2-Shot Sequential Overmolding Analysis

Simulates the process where a rigid substrate is overmolded with a flexible material

Facilitates the evaluation of the effect of the substrate on the flow of the overmolded material

Predicts potential thermal degradation of the substrate due to reheating as a result of the injection of the hot overmolded plastic material

Insert Overmolding Analysis

Analyze material flow around polymer or metal inserts

Inserts can be imported as solid models and meshed along with the cavity
using 3D tetrahedral elements

Facility to specify temperature and material properties of the insert

Obtain temperature variation within the insert during the entire molding cycle

Flexibility to use an unmatched mesh along the interface of the part and inserts

Supports both thermoplastic and thermoset applications

Fiber Analysis

Fibers play an important part in the design and manufacture of plastic parts; MPI/3D integrates with MPI/Fiber to accurately predict the orientation of fibers and the thermo-mechanical property distribution in the molded part

Cooling Analysis

MPI/3D interfaces with MPI/Cool to optimize the mold and cooling circuit design to achieve uniform component cooling of thick-walled plastics parts

Warpage Analysis

MPI/3D interfaces with MPI/Warp to estimate the part geometry’s tendency to warp

Part warpage due to the effects of unbalanced cooling, non-uniform shrinkage, and molecular/fiber orientation can be evaluated

Reactive Molding Analysis

MPI/3D integrates with MPI/Reactive Molding to simulate molding processes with thermoset materials on 3D solid models. Analysis capabilities include:
- Thermoset injection molding
- Rubber injection molding
- Resin transfer molding

Microchip Encapsulation Analysis

MPI/3D integrates with MPI/Microchip Encapsulation to simulate the encapsulation, wire-sweep and paddle shift of semiconductor microchips using 3D tetrahedral mesh

Accurate pressure distribution and melt front predictions are feasible for complicated leadframe geometries

Eliminates the need for special modeling of leadframe geometry for calculation of cross flow of polymer in between the leads

Underfill Encapsulation Analysis

MPI/3D integrates with MPI/Underfill Encapsulation to simulate the manufacture of flip chips by the dispensing encapsulation process

Benefits of using 3D tetrahedral mesh include reduced model preparation and accurate consideration of the effects of solders on flow

A Complete Solution

A true 3D analysis is the most accurate solution method for relatively thick, solid part geometry

MPI/3D features detailed solutions for:
- Mass, momentum, and energy conservation
- Velocity, temperature, and pressure data at each node
- Explicit calculation of the fountain flow at the flowfront gives the user deep insight into true plastic behavior in solids

Analyzes filling, packing, cooling and warpage

Predicts inertia effects, gravity effects, and shear heating

Predicts jetting phenomenon

Allows detailed studies of weld-line and air-trap formation

Studies thermal drag effects at the part surface

Shows gate freeze-off on complex geometry

Analysis Capabilities

Full Navier Stokes solver:
- Includes inertia effects
- Includes gravity effects
- Includes extensional viscosity effects
- Includes pressure dependency of viscosity effects

Stokes Solver

Restart various packing setups from the end of a single filling analysis

Packing stand-alone analysis allows a holding phase study without having to first perform a filling analysis

Solver Features

3-component velocity solution
Robust temperature convection

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MPI / 3D
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MPI / 3D
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MPI / 3D
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MPI / 3D
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