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MPA Extension Modules

Add-on options enable part and mold designers to:


Advanced 3D

Expand the range of parts that can be analyzed.

  • Analyze parts that have thick, solid regions or excessive variations in part thickness

  • The best of both worlds with the speed of Dual Domain for traditional, thin wall designs combined with 3D analysis when advanced technology is required for nontraditional parts

  • Superior ease of use with embedded intelligence that automatically determines which technology to use



Moldflow Plastics Advisers (MPA®)

MPA Information

» Overview

» What's New in MPA 8.1
» Tech Specs
» Download MPA Brochure
» White Paper
» Which Module is right for you?
» Why use flow analysis?
» MPA Extension Modules

MPA Advanced 3D Gallery



True 3D analysis capability allows accurate simulation of parts with thick, solid regions.





Performance Adviser
- Overview Video
Two key features in Performance Adviser are Packing Analysis and Warpage Indicator.

Packing Analysis
Optimize the second stage of the injection molding process

  • Achieve the optimum balance between part quality, part cost, and cycle time

  • Determine the optimal packing pressure and duration of packing

  • Review the volumetric shrinkage, cycle time, and the average temperature across the part
Packing Analysis
Packing results - volumetric shrinkage

Warpage Indicator
Avoid costly fixes to molds while they are in production

  • Easily identify problem areas with a traffic-light plot (analogous to the Confidence-of-Fill plot)

  • Investigate the source of warpage and obtain recommendations to fix the problem

  • Evaluate how changes to the part design, mold design, material or process conditions will bring warpage to acceptable levels - before incurring the cost of cutting steel
Warpage Indicator
The warpage indicator highlights areas where part warpage is high.

During the design phase, adjust the part design, mold design, material or process conditions to optimize the design and avoid warpage.


Cooling Circuit Adviser
  - Overview Video
Two key features in Cooling Circuit Adviser are Cooling Circuit Design and Evaluation and Automatic Cooling Layout Wizard.

Cooling Circuit Design and Evaluation
Achieve uniform cooling while minimizing cycle time.

  • Model and evaluate regular cooling channels, baffles, bubblers, and hoses

  • Improve part quality by identifying hot spots and non-uniform cooling regions while it is easy to make part or mold design changes

  • Reduce cycle time by locating regions that take a long time to cool

  • Maximize efficency of the cooling system with results such as Reynolds number flow rate, pressure, and temperature

Cooling Circuit Adviser
Quickly design and evaluate cooling circuit layouts to achieve uniform cooling with a minimum cycle time.

Automatic Cooling Layout Wizard
Automate the cooling circuit design process

  • Save time by automatically generating an initial cooling system.

  • Standard rules generate the location and sizes of the cooling channels

  • Adjust the cooling lines to account for ejector pins and other mold components.

 

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